this post was submitted on 22 Oct 2024
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With AI showing no signs of slowing, TSMC will be ramping up its advanced chip packaging capabilities over the next few years. During its recent earnings call on October 17, the chipmaker revealed that its production capacity for CoWoS packaging technology is set to double year-over-year in both 2024 and 2025.

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[–] derpgon 3 points 1 month ago

Well, I sure hope it can be repurposed when the bubble bursts.