this post was submitted on 25 Sep 2023
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Apple Event 2023 - Spoofed | Malayalam Sketch (youtu.be)
submitted 1 year ago by [email protected] to c/[email protected]
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[–] [email protected] 2 points 1 year ago (1 children)

A system in package, or SiP, is a way of bundling two or more ICs inside a single package. This is in contrast to a system on chip, or SoC, where the functions on those chips are integrated onto the same die.

[–] [email protected] 1 points 1 year ago (1 children)

kind of like AMD chiplets but more integrated?, Intel is also going in that direction for packaging.

[–] [email protected] 2 points 1 year ago

Yes. But with two ICs